Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)
Product details
| Management number | 233619936 | Release Date | 2026/06/27 | List Price | US$81.95 | Model Number | 233619936 | ||
|---|---|---|---|---|---|---|---|---|---|
| Category | |||||||||
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.- Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging- Features experimental characterization and qualifications for the analysis and verification of electronic packaging design- Provides multiphysics modeling and analysis techniques of electronic packaging Read more
| ASIN | B081LWS3WW |
|---|---|
| XRay | Not Enabled |
| ISBN13 | 978-0081025338 |
| Edition | 1st |
| Language | English |
| File size | 170.7 MB |
| Page Flip | Enabled |
| Publisher | Woodhead Publishing |
| Word Wise | Not Enabled |
| Print length | 427 pages |
| Accessibility | Learn more |
| Part of series | Woodhead Publishing Series in Electronic and Optical Materials |
| Publication date | November 14, 2019 |
| Enhanced typesetting | Enabled |
Bestseller ranking
Bubble Bath
Customers who viewed this product also viewed
Microelectronics
Correction of product information
If you notice any omissions or errors in the product information on this page, please use the correction request form below.
Correction Request Form